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 M54134FP/GP
Earth Leakage Current Detector
REJ03F0030-0100Z Rev.1.0 Sep.16.2003
Description
The M54134FP/GP is a semiconductor integrated circuit developed for use in high-speed earth leakage breakers incorporating functions to protect against voltage surges and inverter noise.
Features
* Lightning surge protection Two-count method adopted Improved dead-time performance for lightning impulses * Inverter support For active/low-pass filter use Internal op-amp (low current consumption) Improved high-frequency, high harmonic superposition performance * Internal time delay function A time delay function can be configured * High input sensitivity VT=11.5 mVrms * Low current consumption Standby: 610 A (typical) Leakage detection: 650 A (typical) * High-stability design Adopts a circuit with minimal characteristic fluctuation when changes occur in the power supply voltage or ambient temperature
Applications
* Earth leakage breaker
Recommended Operating Conditions
* Operating power supply voltage range: 7 to 12 V * Operating ambient temperature: -20 to 85C
Rev.1.0, Sep.16.2003, page 1 of 17
M54134FP/GP
Block Diagram
VS 16 OPI+ 15 C1 14 OPI- 13 C2 12 OPAO 11 ILKI 10 VREF 9
- A +
M54133FP/GP
POWER SUPPLY CIRCUIT LEAKAGE DETECTION SCR DRIVER
1 GND
2 IREF
3 VCC
4 OFFC
5 TRC1
6 TRC2
7 DLYC
8 SCRT
Rev.1.0, Sep.16.2003, page 2 of 17
M54134FP/GP
Pin Configuration
GND 1 IREF 2 16 VS 15 OPI+
M54134FP/GP
VCC 3 OFFC 4 TRC1 5 TRC2 6 DLYC 7 SCRT 8
14 C1 13 OPI- 12 C2 11 OPAO 10 ILKI 9 VREF
Outline 16P2N-A(FP) Outline 16P2E-A(GP)
Pin Description
Pin no. 16 Name VS Function Power supply
* Common
3 2 1 VCC IREF GND Output pin for internal constant-voltage circuit; connected to decoupling capacitor Pin for connection to resistor to set constant current for internal circuits; approx. 1.3 V Ground
* Op-amp
13 15 14 12 11 CPI- CPI+ C1 C2 OPAO Op-amp input pins Pin for connection to capacitors to prevent noise-induced erroneous operation; connected between pins [13], [14] and pins [15], [14] Pin for connection to capacitor to prevent oscillation; connected with pin [11]. Op-amp output pin
* Leakage detection, SCR driving circuit
9 10 5 6 4 VREF ILKI TRC1 TRC2 OFFC Input reference level pin for leak detection circuit; approx. 2.4 V Another input pin for leak detection circuit Pin to connect a capacitor used to integrate the level discriminator output signal of the leak input signal Pin to connect a capacitor for noise elimination When leak input signal is not continued When a leak is detected and SCR is turned on After a prescribed amount of time, this IC is returned to the initial state. A capacitor to set the time for this function is connected. Pin to connect a capacitor to set the time when using the time delay function Thyristor driving output pin
7 8
DRYC SCRT
Rev.1.0, Sep.16.2003, page 3 of 17
M54134FP/GP
Absolute Maximum Ratings
(Unless otherwise noted, Ta = 25C) Symbol IS IVSmax. Vid IIOP IIG Pd Topr Tstg Parameter Power supply current Maximum power supply voltage Differential input voltage Differential input current Input current Power consumption Operating ambient temperature Storage temperature Test conditions Ratings 4 15 -0.8 to 0.8 -5 to 5 10 200 -20 to 85 -55 to 125 Unit mA V V mA mA mW C C
Across OPI+ and OPI- Across OPI+ and OPI- Across VREF and GND
Rev.1.0, Sep.16.2003, page 4 of 17
M54134FP/GP
Electrical Characteristics
(Unless otherwise noted, Ta = 25C)
Symbol Is0 Is1 Is2 -- VSmax. VCC GV BW VO ISOURCE ISINK VOF IIB VIB VION IIH VREF VCL EIOH1 VTH1 ETW1 -- EIOH2 VTH2 ETW2 -- EIOH3 VTH3 ETW3 EIOH4 VTH4 ETW4 VOL8 IOHc IOHn IOHh Vsoff VT -- Overall trip IOH hold power supply voltage Overall leak detection AC voltage VT ambient temperature dependence -- 9V 60 Hz Ta = +25 to 80C Ta = +25 to -20C Time delay circuit SCR driver circuit Reset circuit 1 ms circuit Leakage detection circuit 3 ms circuit Opamp Quantity Power supply circuit Power supply current, during standby Power supply current, during leak detection Power supply current, immediately after SCR driving Is0 ambient temp. storage dependence Voltage at max. current VCC pin output voltage Voltage amplification Frequency band Maximum output voltage OPAO pin "H" output current OPAO pin "L" output current Output offset voltage Input bias current Differential input clamping voltage Leakage detection DC input voltage ILK1 pin input bias current VREF pin output voltage VREF-GND clamping voltage TRC1 pin "H" output current precision TRC1 pin threshold voltage Tw1 pulse width precision Tw1 ambient temperature dependence TRC2 pin "H" output current precision TRC2 pin threshold voltage Tw2 pulse width precision Tw2 ambient temperature dependence OFFC pin "H" output current precision OFFC threshold voltage Reset timer pulse width precision DLYC pin "H" output current precision DLYC threshold voltage Time delay timer pulse width precision SCRT pin "L" output voltage SCRT pin "H" output current 9V 9V 9V C4 = 1.0 F; TW2 = 300 ms IOL = 200 A VO = 0.8 V Ta = -20C Ta = 25C Ta = 85C 9V 9V C3 = 0.33 F; TW2 = 75 ms VO = 0; IOH = -7.6 A 9V C2 = 0.0047 F; TW2 = 1.5 ms Ta = -20 to 85C VO = 0; IOH = -7.6 A 9V C1 = 0.01 F; TW1 = 3 ms Ta = -20 to 85C VO = 0; IOH = -7.6 A 9V 9V Iidc = 4 mA vs. VREF VIN = VREF IOH = -200 A IRCL = 5 mA VO = 0; IOH = -7.6 A 9V -- 9V 9V Ta = -20 to 85C IS = 4 mA IOH = -1 mA f = 1 kHz -3 dB Measurement conditions Vs 9V Ratings Min. 520 560 480 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -10 -- -15 -- -10 -- -15 -- -10 -- -30 -10 -- -30 -- -100 -50 -30 -- -- -- -- Typ. 610 650 570 -0.2 13.9 5.2 40 6 3.5 2.8 0.8 0 125 0.8 14 220 2.4 4.7 -- 2.4 -- 0 -- 2.4 -- 0 -- 2.4 -- -- 2.4 -- 0.1 -160 -130 -100 3.0 11.5 -8.0 +2.0 30 0.2 -- -- -- 4.0 -- -- -- 30 10 Max. 700 740 660 -- 15 -- -- -- -- -- -- -- -- -- -- -- -- -- 10 -- 15 -- 10 -- 15 -- 10 A A A %/C V V dB kHz Vpp mA mA mV nA V mVdc nA V V % V % %/C % V % %/C % V % % V % V A A A V mVrms %/C Units
Rev.1.0, Sep.16.2003, page 5 of 17
M54134FP/GP
Timing Charts
WITHOUT DELAY FUNCTION
ILKI INPUT
2.4V
TRC1 PIN
Tw1
TRC2 PIN
2.4V
DLYC PIN
2.4V Tw2
2.4V
OFFC PIN
0.7V Tw3
SCRT OUTPUT
USING DELAY FUNCTION
ILKI INPUT
TRC1 PIN
2.4V
TRC2 PIN
2.4V
DLYC PIN
2.4V
Tw4
OFFC PIN
2.4V
Tw3
SCRT OUTPUT
Rev.1.0, Sep.16.2003, page 6 of 17
M54134FP/GP
Input/Output Equivalent Circuit
3 VS 16 200 VCC
BAND GAP 1.3V
2
IREF EXTERNAL R (180k)
12 C2 VCC 800 2.4V 100 OPI- 13 470 11 OPAO OPI+ 15 100 C1 14 8 6 STAGES 25A 48k SCRT ILKI 10 4.7k VREF 9 200k
VCC 7.5A 7.5A 7.5A
2.4V
100
5 6
TCR1 TCR2
4
OFFC
7
DLYC
Units Resistance : Capacitance : F
Rev.1.0, Sep.16.2003, page 7 of 17
M54134FP/GP
Precaution for Application
Described below are precautions on usage of the M54134FP and the M54134GP. Note that each precaution presents a still better example. It is advisable to review it carefully to learn optimal conditions.
1. Voltage applied to VS (1) Fig.1 shows characteristics of circuit current IS. (IS characterizes clamp circuit shown in INPUT/OUTPUT equivalent circuits.) To design power supply, adapt it to IC, considering IS characteristics. (2) Rectification for use of commercial AC line as power source.
RS VS COMMERCIAL AC LINE VZ IC
3 IS (mA) +25C 2 1 0 +85C -20C
12 VS(V)
13
14
15
Fig. 1 CHARACTERISTICS OF VS TO IS
a) For VZ, select zener diode of 12V or less. (Prevent supply voltage VS from exceeding absolute maximum rating of 15V.) b) Escalated temperature may decrease supply voltage to produce large current IS. In this case, RS limits IS. (3)For use of common DC power supply, set supply voltage VS within range of 7 to 12V. 2. Resistor (R = 180k) at IREF pin This resistor provides constant-reference-current source for IC. (Constant current source protects IC against fluctuations in supply voltage and ambient temperature.) Since every circuit is characterized by resistance of this resistor, the use of high-precision resistor (accuracy of 2%) is recommended. 3. Laying out printed-circuit board Foreign noise (from noise simulator, for example) may cause malfunctions. To improve noise resistance, lay out printed-circuit patterns so that wirings of IC to additional capacitors and resistors can be made as short as possible. Carefully design patterns especially for wiring capacitors to VS of [16] pin , VCC of [3] pin , and SCRT of [8] pin. 4. Avoid SCRT output pin voltage from falling negative below GND level.
Rev.1.0, Sep.16.2003, page 8 of 17
M54134FP/GP 5. Reset time applicable to reset timer circuit The M54134 has reset timer circuit of VL=0.7V, VH=2.4V, and IO=7.5A. When SCR is on, power supply path is disconnected from leak detector circuit. As shown in illustration below, disconnection may inhibit VL from falling to 0.7V. Accordingly, reset time may get shortened. To avoid shortage, predetermine a reset time that includes extra time.
T= CX(VH-VL) = 0.33FX(2.4-0.7) =75ms IO 7.5A
3.8V
WAVEFORMS AT OFFC PIN
2.4V
0.7V 75ms
WAVEFORMS AT SCRT PIN
0V t=10ms Note. Predetermined reset time may get shortened by t.
Rev.1.0, Sep.16.2003, page 9 of 17
M54134FP/GP
Typical Characteristics
THERMAL DERATING (MAXIMUM RATING) 250
POWER DISSIPATION Pd (mW)
200
150
100
50
0
0
25
50
75
100
125
150
AMBIENT TEMPERATURE Ta (C)
SUPPLY CURRENT VS. SUPPLY VOLTAGE CHARACTERISTICS 4 STANDBY +85C
SUPPLY CURRENT (mA)
SUPPLY CURRENT VS. SUPPLY VOLTAGE CHARACTERISTICS 800 Ta=+25C
SUPPLY CURRENT (A)
3
+25C -20C
700 LEAK DETECTION STANDBY 600 WHEN SCR IS ON
2
1
500
0 0 5 10 15 SUPPLY VOLTAGE (V)
400 6 8 10 12 SUPPLY VOLTAGE (V)
SUPPLY CURRENT VS. AMBIENT TEMPERATURE CHARACTERISTICS 800 VS=9V
SUPPLY CURRENT (A) VOLTAGE GAIN (dB)
VOLTAGE GAIN VS. FREQUENCY CHARACTERISTICS 50 VS=9V 40
700 LEAK DETECTION STANDBY 600 WHEN SCR IS ON 500
30
20
400 -50
10 0 50 100 AMBIENT TEMPERATURE (C)
1
10
100
1k
10k
100k
1M
FREQUENCY (Hz)
Rev.1.0, Sep.16.2003, page 10 of 17
M54134FP/GP
OPERATIONAL AMPLIFIER INPUT CURRENT BIAS VS. AMBIENT TEMPERATURE CHARACTERISTICS 400 VS=9V MAXIMUM OPERATIONAL AMPLIFIER OUTPUT CURRENT VS. AMBIENT TEMPERATURE CHARACTERISTICS 4 VS=9V 3
300
200
MAXIMUM OUTPUT CURRENT (mA)
INPUT BIAS CURRENT (nA)
2
100
1
0 -50
0
50
100
0 -50
0
50
100
AMBIENT TEMPERATURE (C)
AMBIENT TEMPERATURE (C)
IREF OUTPUT VOLTAGE VS. SUPPLY VOLTAGE CHARACTERISTICS 1.5 Ta=+25C
IREF OUTPUT VOLTAGE VS. AMBIENT TEMPERATURE CHARACTERISTICS 1.5 VS=9V
IREF OUTPUT VOLTAGE (V)
1.4
IREF OUTPUT VOLTAGE (V)
6 8 10 12
1.4
1.3
1.3
1.2
1.2
1.1 SUPPLY VOLTAGE (V)
1.1 -50
0
50
100
AMBIENT TEMPERATURE (C)
VREF OUTPUT VOLTAGE VS. SUPPLY VOLTAGE CHARACTERISTICS 2.7 Ta=+25C
VREF OUTPUT VOLTAGE VS. AMBIENT TEMPERATURE CHARACTERISTICS 2.7 VS=9V
VREF OUTPUT VOLTAGE (V)
VREF OUTPUT VOLTAGE (V)
6 8 10 12
2.6
2.6
2.5
2.5
2.4
2.4
2.3
2.3 -50
0
50
100
SUPPLY VOLTAGE (V)
AMBIENT TEMPERATURE (C)
Rev.1.0, Sep.16.2003, page 11 of 17
M54134FP/GP
VCC OUTPUT VOLTAGE VS. SUPPLY VOLTAGE CHARACTERISTICS 6.0 Ta=+25C
VCC OUTPUT VOLTAGE (V)
VCC OUTPUT VOLTAGE VS. AMBIENT TEMPERATURE CHARACTERISTICS 6.0 VS=9V
VCC OUTPUT VOLTAGE (V)
5.5
5.5
5.0
5.0
4.5
4.5
4.0
6
8
10
12
4.0 -50
0
50
100
SUPPLY VOLTAGE (V)
AMBIENT TEMPERATURE (C)
TRC1/TRC2/OFFC/DLYC THRESHOLD VOLTAGE VS. SUPPLY VOLTAGE CHARACTERISTICS 3.0 Ta=+25C
THRESHOLD VOLTAGE (V) THRESHOLD VOLTAGE (V)
TRC1/TRC2/OFFC/DLYC THRESHOLD VOLTAGE VS. AMBIENT TEMPERATURE CHARACTERISTICS 3.0 VS=9V
2.5
2.5
2.0 6 8 10 12 SUPPLY VOLTAGE (V)
2.0 -50
0
50
100
AMBIENT TEMPERATURE (C)
TRC1/TRC2/OFFC/DLYC "H" OUTPUT CURRENT VS. SUPPLY VOLTAGE CHARACTERISTICS 10 Ta=+25C
"H" OUTPUT CURRENT (A) "H" OUTPUT CURRENT (A)
TRC1/TRC2/OFFC/DLYC "H" OUTPUT CURRENT VS. AMBIENT TEMPERATURE CHARACTERISTICS 10 VS=9V 9
9
8
8
7
7
6
6
8
10
12
6 -50
0
50
100
SUPPLY VOLTAGE (V)
AMBIENT TEMPERATURE (C)
Rev.1.0, Sep.16.2003, page 12 of 17
M54134FP/GP
TRC1 PULSE WIDTH VS. SUPPLY VOLTAGE CHARACTERISTICS 4 Ta=+25C TRC1=0.01F TRC1 PULSE WIDTH VS. AMBIENT TEMPERATURE CHARACTERISTICS 4 VS=9V TRC1=0.01F
TRC1 PULSE WIDTH (ms)
TRC1 PULSE WIDTH (ms)
6
3
3
2
8
10
12
2 -50
0
50
100
SUPPLY VOLTAGE (V)
AMBIENT TEMPERATURE (C)
OFFC "L" OUTPUT VOLTAGE (V)
1.0
OFFC "L" OUTPUT VOLTAGE (V)
OFFC "L" OUTPUT VOLTAGE VS. SUPPLY VOLTAGE CHARACTERISTICS 1.2 Ta=+25C
OFFC "L" OUTPUT VOLTAGE VS. AMBIENT TEMPERATURE CHARACTERISTICS 1.2 VS=9V 1.0
0.8
0.8
0.6
0.6
0.4 6 8 10 12 SUPPLY VOLTAGE (V)
0.4 -50
0
50
100
AMBIENT TEMPERATURE (C)
OFFC PULSE WIDTH (ms)
OFFC PULSE WIDTH (ms)
OFFC PULSE WIDTH VS. SUPPLY VOLTAGE CHARACTERISTICS 100 Ta=+25C OFFC=0.33F 90
OFFC PULSE WIDTH VS. AMBIENT TEMPERATURE CHARACTERISTICS 100 VS=9V OFFC=0.33F 90
80
80
70
70
60
6
8
10
12
60 -50
0
50
100
SUPPLY VOLTAGE (V)
AMBIENT TEMPERATURE (C)
Rev.1.0, Sep.16.2003, page 13 of 17
M54134FP/GP
DLYC PULSE WIDTH VS. SUPPLY VOLTAGE CHARACTERISTICS 400 Ta=+25C DLYC=1.0F DLYC PULSE WIDTH VS. AMBIENT TEMPERATURE CHARACTERISTICS 400 VS=9V DLYC=1.0F
DLYC PULSE WIDTH (ms)
350
DLYC PULSE WIDTH (ms)
6
350
300
300
250
250
200
8
10
12
200 -50
0
50
100
SUPPLY VOLTAGE (V)
AMBIENT TEMPERATURE (C)
TOTAL LEAK DETECTION AC VOLTAGE (mVms)
11
TOTAL LEAK DETECTION AC VOLTAGE (mVms)
TOTAL LEAK DETECTION AC VOLTAGE VS. SUPPLY VOLTAGE CHARACTERISTICS 13 Ta=+25C TRC1=0.01F fin=60Hz 12
TOTAL LEAK DETECTION AC VOLTAGE VS. AMBIENT TEMPERATURE CHARACTERISTICS 13 VS=9V TRC1=0.01F fin=60Hz 12
11
10
10
9 6 8 10 12 SUPPLY VOLTAGE (V)
9 -50
0
50
100
AMBIENT TEMPERATURE (C)
SCRT "L" OUTPUT VOLTAGE VS. "L" OUTPUT CURRENT CHARACTERISTICS
SCRT "L" OUTPUT VOLTAGE (V)
SCRT "L" OUTPUT VOLTAGE (V)
SCRT "L" OUTPUT VOLTAGE VS. AMBIENT TEMPERATURE CHARACTERISTICS 0.4 VS=9V IOL=200A 0.3
0.2
0.1
0 -50
0
50
100
AMBIENT TEMPERATURE (C) "L" OUTPUT CURRENT (A)
Rev.1.0, Sep.16.2003, page 14 of 17
M54134FP/GP
SCRT "H" OUTPUT CURRENT VS. SUPPLY VOLTAGE CHARACTERISTICS 400 Ta=+25C 300 SCRT "H" OUTPUT CURRENT VS. AMBIENT TEMPERATURE CHARACTERISTICS 400 VS=9V 300
SCRT "H" OUTPUT CURRENT (A)
200
SCRT "H" OUTPUT CURRENT (A)
200
100
100
0
0
2
4
6
8
10
12
0 -50
0
50
100
SUPPLY VOLTAGE (V)
AMBIENT TEMPERATURE (C)
Rev.1.0, Sep.16.2003, page 15 of 17
16P2N-A
JEDEC Code -- e b2 Weight(g) 0.2 Lead Material Cu Alloy
MMP
Plastic 16pin 300mil SOP
M54134FP/GP
EIAJ Package Code SOP16-P-300-1.27
Package Dimensions
16
9
HE
E
L1
L
Rev.1.0, Sep.16.2003, page 16 of 17
e1
Recommended Mount Pad Symbol
8
1
F A
G
D
A2
b
A1
x
M
e y
A A1 A2 b c D E e HE L L1 z Z1 x y c
z Detail G Detail F
Z1
b2 e1 I2
Dimension in Millimeters Min Nom Max 2.1 0 0.1 0.2 -- 1.8 -- 0.35 0.4 0.5 0.18 0.2 0.25 10.0 10.1 10.2 5.2 5.3 5.4 -- 1.27 -- 7.5 7.8 8.1 0.4 0.6 0.8 -- 1.25 -- -- 0.605 -- -- 0.755 -- -- 0.25 -- -- 0.1 -- 0 8 -- -- 0.76 -- 7.62 -- -- 1.27 --
I2
16P2E-A
JEDEC Code e b2
16 9
Plastic 16pin 225mil SSOP
Weight(g) 0.06 Lead Material Alloy 42
M54134FP/GP
EIAJ Package Code SSOP16-P-225-0.65
HE
E
L1
L
Rev.1.0, Sep.16.2003, page 17 of 17
F
e1
Recommended Mount Pad Symbol
1
8
A
G
D
A2
b
A1
e y
x
M
c z Z1 Detail G Detail F
A A1 A2 b c D E e HE L L1 z Z1 x y b2 e1 I2
Dimension in Millimeters Min Nom Max 1.45 0.2 0.1 0 1.15 0.32 0.22 0.17 0.2 0.15 0.13 5.1 5.0 4.9 4.5 4.4 4.3 0.65 6.6 6.4 6.2 0.7 0.5 0.3 1.0 0.225 0.375 0.13 0.1 0 10 0.35 5.8 1.0
I2
Sales Strategic Planning Div.
Keep safety first in your circuit designs!
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
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